Thermal paste hpx 100g ag

HPX 100G Silicone Thermal Conductive Paste AG Termopasty. Thermal paste HPX with thermal conductivity >2.8 W/mK, electrically non-conductive. Essential for proper operation of all types of temperature sensors. Low thermal impedance maintains constant efficiency from -50 to 250°C. Applications: Modules with high thermal conductivity; Cooling devices on end plates and frames; High-speed storage drives; Motor control systems (automotive industry); Hard disk and DVD drives; Power converters; High-power LEDs; Notebooks and office computers; Network communication devices; Household appliances, electronic and electrical components; Air conditioners. Physicochemical properties: Color: gray; Thermal conductivity: >2.8 W/mK; Thermal impedance: °C in²/W; Specific gravity: >2.15 g/cm³; Evaporation: 0.001; Leakage: 0.05; Dielectric constant: 5.1; Viscosity: non-flowing; Thixotropic index: 380±10; Temperature resistance: -50°C to 300°C; Operating temperature: -50°C to 250°C.