Easy print sn96.5ag3cu0.5 1.4ml ag

Easy Print Sn96.5Ag3Cu0.5 Solder Paste, AG39. Easy Print Sn96.5Ag3Cu0.5 by AG Termopasty is a paste designed for soldering SMD components in production processes without washing phases. Based on No Clean flux, requiring no cleaning, with residues that do not cause corrosion. Compatible with all lead-free alloys, featuring good adhesion and wettability of soldered surfaces. Retains physicochemical properties even after 20 hours on PCB. Product features: Alloy type: Sn96.5/Ag3/Cu0.5; Density: 4.6 g/cm³; Printability over 8h; Chloride-free; Flux residue non-corrosive, no cleaning required; Solder joints have good mechanical and electrical properties; Resistant to mid-chip solderballing; Good adhesion to components for over 24 hours after application; Faithful stencil life up to 8 hours continuous printing; Minimal, colorless, non-corrosive no-clean residues facilitating tester needle penetration; High fine pitch detail reproduction; Printing speeds up to 150 mm/s.