Easy print (Sn62Pb36Ag2) 6g Ag

Paste intended for soldering SMD components in production processes without washing phases. Based on No Clean flux, requiring no washing, whose residues do not cause corrosion spots. The product works with all lead-free alloys, features good adhesion and wettability of the soldered surface. It does not lose its physicochemical properties even after 20 hours left on the PCB. This time depends on room conditions: humidity and temperature.
Contains rosin-based flux
Presence of activator preventing air bubble formation in soldered joints
These joints have very good mechanical and electrical properties
If the process includes a washing phase, it can be done with commonly available agents (water-based PCB cleaner, alcohol-based PCB cleaner).
Specification:
Manufacturer: AG TermoPasty
Packaging: 1.4 ml syringe