Silver thermal paste 100g AG

High Thermal Conductivity: Silver Paste is enriched with silver compounds, providing thermal conductivity >3.8 W/mK. It effectively dissipates heat, crucial for optimal equipment performance. The paste color is silver, visually emphasizing its advanced technology.
Versatile Use: Ideal for filling micro-irregularities between contacting parts like processor and heatsink. Also excellent as a heat conductor from heat pipe condenser to exchanger in vacuum solar collectors. Its universal application makes it indispensable in computers and advanced heating systems.
Low Thermal Impedance and Thermal Stability: With thermal impedance below 0.067 °C in²/W, Silver Paste minimizes thermal resistance, improving cooling and extending electronic component lifespan. It operates effectively from -50°C to 250°C, temporarily up to 340°C. Perfect for high-reliability applications in extreme conditions.
Physicochemical Properties: Silver Paste has a density of 2.37 g/cm³ at 20°C and extremely low evaporation (<0.001%), ensuring long-lasting effectiveness. Its viscosity prevents flow, and a thixotropic index of 380 ± 10 allows easy spreading. Cross resistivity is 2.9 x 10¹³ Ohm·cm, providing excellent electrical insulation. Dielectric loss tangent tg δ at 120 Hz is below 0.001, and relative dielectric constant εr at 120 Hz is 13.9, highlighting advanced dielectric properties. Electrical strength is 500 V/mm.